DLC coating for semiconductor forming molds
It is a DLC coating using a hybrid process of PVD and plasma CVD.
The semiconductor forming die's Celtes DLC coating is a new DLC (diamond-like carbon) coating produced by a hybrid process of PVD and plasma CVD. By adopting a composite multilayer film, it demonstrates superior adhesion compared to conventional DLC and allows for thick films (up to 5μm), resulting in exceptional durability. Additionally, it can withstand high surface pressures due to the use of a substrate reinforcement layer, not only on cemented carbide but also on tool steel. The DLC coating has a very smooth and hard surface with a low friction coefficient, preventing adhesion of soft metals such as solder plating and aluminum. This significantly reduces defects caused by solder debris adhering to the mold and dramatically improves productivity by decreasing cleaning frequency. For more details, please download the catalog.
- Company:ナノコート・ティーエス 石川事業所
- Price:Other